The YCS Mr.Yang M.Y-005 is a heat-resistant magnetic silicone pad built for tin planting and BGA reballing work on mobile phone motherboards. It carries four slot sizes — 0.35mm, 0.45mm, 0.55mm, and 0.65mm — so you can handle CPU, NAND, and other BGA chips of different thicknesses on a single mat. The strong magnetic base holds the steel mesh stencil firmly in place during tinning, so it doesn't shift or lift while you work. Heat dissipation holes on the back stop the mesh from bulging under soldering heat. A practical bench accessory for any GSM technician doing IC reballing or chip-level repair.
