{"title":"Mobile Repair Soldering Accessories — Flux, Solder Paste, BGA Stencils Pakistan","description":"\u003cp\u003eBrowse our Mobile Repair Soldering Accessories — Flux, Solder Paste, BGA Stencils Pakistan collection. Best Price.\u003c\/p\u003e","products":[{"product_id":"ycs-mryang-my-005-strong-magnetic-silicone-pad-heat-resistant-tin-planting-mat","title":"YCS Mr.Yang M.Y-005 Strong Magnetic Silicone Pad – Heat-Resistant Tin Planting Mat","description":"\u003cp\u003eThe YCS Mr.Yang M.Y-005 is a heat-resistant magnetic silicone pad built for tin planting and BGA reballing work on mobile phone motherboards. It carries four slot sizes — 0.35mm, 0.45mm, 0.55mm, and 0.65mm — so you can handle CPU, NAND, and other BGA chips of different thicknesses on a single mat. The strong magnetic base holds the steel mesh stencil firmly in place during tinning, so it doesn't shift or lift while you work. Heat dissipation holes on the back stop the mesh from bulging under soldering heat. A practical bench accessory for any GSM technician doing IC reballing or chip-level repair.\u003c\/p\u003e","brand":"KB GSM Store","offers":[{"title":"Default Title","offer_id":51758756430057,"sku":"ewo1788061001813","price":3.4,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0744\/8422\/0137\/files\/ycs-mryang-my-005-strong-magnetic-silicone-pad-heat-resistant-tin-planting-mat_1.webp?v=1788061005"},{"product_id":"amaoe-u-gge1-bga-reballing-stencil-for-google-tensor-g2g3g4g5-pixel-series-cpu","title":"Amaoe U-GGE1 BGA Reballing Stencil for Google Tensor G2\/G3\/G4\/G5 – Pixel Series CPU","description":"\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"mso-ansi-language: #2000;\"\u003eReball the Google Tensor CPU and RAM496 package on Pixel motherboards without hunting for separate stencils. The Amaoe U-GGE1 covers Tensor G2, G3, G4, and G5 package codes on a single 0.12mm laser-cut mesh, so you switch between Pixel generations on the same bench without swapping tools. Built for technicians who handle dead-after-flash, hang-on-logo, and hardware-fault jobs on Pixel boards regularly. Line up the pads, drop solder balls in one pass, lift, and reflow — no guesswork on ball pitch. A compact, single-purpose stencil that earns its spot in a Tensor-focused repair kit.\u003c\/span\u003e\u003c\/p\u003e","brand":"KB GSM Store","offers":[{"title":"Default Title","offer_id":51758756462825,"sku":"mde1788061007981","price":2.45,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0744\/8422\/0137\/files\/amaoe-u-gge1-bga-reballing-stencil-for-google-tensor-g2g3g4g5-pixel-series-cpu_1.webp?v=1788061013"}],"url":"https:\/\/sagefieldgoods.shop\/collections\/mobile-repair-soldering-accessories-flux-solder-pa.oembed","provider":"My Store","version":"1.0","type":"link"}